Fatigue Crack Propagation Analysis for Micro Solder Joints with Void
نویسندگان
چکیده
منابع مشابه
Fatigue damage in solder joints
Miniaturisation of electronic products is increasingly important for reasons of functionality enhancement and freedom of design. This is realised by integration into silicon and developing miniature packages with high I/O and power dissipation density. Generally this leads to elevated temperatures, not only in the components but also in the solder joints. Elevated temperature cycling leads to f...
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ژورنال
عنوان ژورنال: Journal of Solid Mechanics and Materials Engineering
سال: 2007
ISSN: 1880-9871
DOI: 10.1299/jmmp.1.169